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IC WORLD 2019

IC WORLD 2019

  • Categories:Company
  • Time of issue:2019-12-03 21:24
  • Views:115

IC WORLD 2019

(Summary description)November 28th to 30th, 2019 Beijing Microelectronics international seminar and IC World Conference 2019 was held in Yichuang International Convention and Exhibition Center (Bejing).

  • Categories:Company
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  • Time of issue:2019-12-03 21:24
  • Views:115
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November 28th to 30th, 2019 Beijing Microelectronics international seminar and IC World Conference 2019 was held in Yichuang International Convention and Exhibition Center (Bejing). With the theme of "Building core ecology and promoting new leaps", the conference focuses on the development trend and latest application of semiconductor industry, attracting more than 200 manufacturing factories to participate in the exhibition, and over 300 experts and scholars carry out high-level academic exchanges around the development status and trend of integrated circuit industry, intelligent manufacturing, breakthrough and innovation of materials and parts, investment and financing of semiconductor industry, etc. Vacree team was led by Wu Yifeng, vice general manager.

 

As a director unit of IC parts alliance, Vacree has exhibited cryocooler and cryopump products, introduced helium compressor and helium pipeline / thermometer, etc..Many exhibitors and experts come to our booth for a talk abnd consult.

 

Since its establishment, Vacree has always focused on low temperature technology research and equipment manufacturing, In January, 2019, Vacree completed the "R & D and industrialization of ultra-high vacuum cooling pump" of the national 02 major project of China (large scale integrated circuit manufacturing equipment and complete process), and passed the project acceptance, initially realizing the localization of key components of integrated circuit ultra-high vacuum cooling pump.

 

Next, Vacree will continue to focus on the needs of industrial development, strengthen technological innovation, and provide users with better services.

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